News & Blog
Role Of Plasma In ACF Bonding
What Role Does Plasma Play in ACF Bonding for Electronics Assembly? Plasma treatment significantly improves Anisotropic Conductive Film (ACF) bonding by removing organic residues, increasing surface energy, and reducing contact resistance. Atmospheric argon plasma...
See Surfx Technologies at SEMICON Taiwan 2025!
Surfx Technologies is excited to participate in SEMICON Taiwan 2025, taking place September 10–12, 2025 in Zhubei City, Hsinchu County, Taiwan. Visit us at Booth K2483 to discover the latest in atmospheric plasma technology for advanced electronics manufacturing....
Successful Presence of Surfx at SEMICON India 2025
We are excited to share that Wen Liu from Surfx Technologies joined our partner MELSS at their booth during SEMICON India 2025. Throughout the event, Wen was onsite to answer technical questions and share insights on how atmospheric plasma solutions can be seamlessly...
How to Overcome Challenges in Plasma Processing
How Can Manufacturers Overcome Common Plasma Processing Challenges? The four main plasma processing challenges are contamination interference, plasma instability, non-uniform treatment, and vacuum bottlenecks. Atmospheric argon plasma addresses all of them: continuous...
Optimizing Surface Readiness for Molding in Semiconductor Production
How Do You Optimize Surface Readiness Before Molding in Semiconductor Production? Proper plasma pre-cleaning before the molding step prevents delamination, adhesion failures, and reliability issues in semiconductor packaging. Atmospheric argon plasma removes organic...