Wetting and Adhesion

A solid with a higher surface energy enhances adhesion and, in some cases, allows materials to bond where it was previously impossible. By improving adhesion, manufacturers can diversify coating materials and apply alternative coatings that may have had difficulty adhering to a surface.

Apart from wettability, it’s also crucial that surfaces are clean. Before applying a coating, ink or glue, it’s important to prepare the surfaces of components, circuit boards and other electronic devices for wetting. A surface must be free of contaminants like release agents, oils, monomers, absorbed organics and additives that could hinder the bonding process.

While conventional cleaning techniques may leave residues, plasma cleaning for electronics assembly readies surfaces efficiently. Plasma treatment can clean various surfaces, inducing metals, plastics, recycled materials, glass and composite materials — making plasma cleaning highly effective for circuit board assemblies.

Plasma by Surfx Technologies

Our argon plasma relies on gases like hydrogen and oxygen to clean surfaces, which does not damage sensitive parts. Where argon-only vacuum plasma generates ion bombardment that can cause damage, our plasma is gentle — safeguarding the integrity of parts.

Because our plasma solutions enhance production efficiency and minimize damage, they positively affect our clients’ bottom lines.