Atomflo™-INT: Integrated Plasma System

Surface Preparation Challenges in Manufacturing Lines

Cleaning the surfaces of the parts is essential for preparing the components for adhesives and coatings. Any dirt, organic material, or oxidation can affect how well materials stick to products. Industries working with medical devices, microelectronics and high-performance components require more efficient solutions. Scalable plasma integration improves bond strength and maintains substrate integrity while integrating into continuous production models.

How the Atomflo™-INT Integrated Plasma System Supports Modern Manufacturing

The Atomflo™-INT plasma system is engineered to integrate automated surface treatment directly into new or existing process equipment. The result? High-performance surface cleaning and activation at atmospheric pressure. Our solution is equipped with Ethernet/IP communication, giving operations precise control over the plasma treatment process. Use this feature to support automated data logging and better traceability.

Surfx’s Atomflo™-INT system fits standard 19-inch server racks for easy manufacturing line integration. Standard controller (437 x 622 x 219 millimeters) and coolant (437 x 523 x 219 millimeters) module dimensions provide a defined footprint for simplified installation planning. Users can choose from a range of plasma head sizes, from 2-millimeter spots to 100-millimeter-wide linear beams. Our system is engineered with adaptability in mind, whether users are working on detailed treatments or high-volume applications.

The Benefits of the Atomflo™-INT

With Surfx’s atmospheric plasma, substrates are cleaned and activated in-line. No part-handling risks or delays like with vacuum chambers. Operations can maximize throughput and efficiency without compromising quality. Our solution offers:

• Real-time process control: The Atomflo™-INT system provides complete transparency into treatment conditions with real-time plasma process monitoring. Engineers can fine-tune process parameters exactly as needed, which improves consistency across production lines. This precise control enables higher gas flow rates, including argon up to 60 LPM and hydrogen-argon mixtures up to 20 LPM.
• Safe treatment: Unlike ion bombardment systems, the Atomflo™-INT uses controlled oxygen and hydrogen mixtures to clean and activate surfaces without damaging sensitive microelectronics or high-value components.
• Streamlined integration: Surfx Technologies designed the Atomflo™-INT for modularity. The system’s server-rack-compatible format simplifies integration into existing tools or automated lines. Reduce the need for stand-alone equipment and accelerate deployment timelines.

How Surfx Technologies Delivers a Competitive Edge

Surfx’s solutions are designed with manufacturing needs in mind. We understand the importance of eliminating downtime while protecting substrates. Our Atomflo™-INT system tackles these issues for a better, faster clean.

Eliminate Downtime

Vacuum plasma systems involve batch processing, which means dealing with time-consuming pump-down and pump-up cycles. Operations see more downtime and reduced throughput, eating into the bottom line. The Atomflo™-INT bypasses these limitations by operating at atmospheric pressure, allowing for continuous, in-line treatment that maximizes uptime.

Gentle Surface Cleaning

Vacuum plasma methods also rely on ion bombardment to clean substrates. This method is aggressive and can cause particle detachment and surface damage. The Atomflo™-INT uses combined plasma chemistry to avoid this issue. This process removes organic residue while maintaining substrate integrity.

Enhance Your Production Line With the Atomflo™-INT

When traceability, consistency and uptime are nonnegotiable, choose Surfx Technologies. Our Atomflo™-INT is a plasma cleaning solution that delivers on every front. It’s a reliable, scalable solution engineered for high-performance surface treatment. Connect with Surfx Technologies today to explore how Atomflo™-INT can transform your production efficiency.