Atmospheric Argon Plasma Systems for Semiconductor Manufacturing
Everything you once did in vacuum you can now do much faster at ambient pressure.
Surface cleaning with atmospheric argon plasma enables durable bond formation that make all the difference in semiconductor packaging. Feeding hydrogen gas to Surfx’s unique plasma produces hydrogen atoms for rapid removing oxidation from metal interconnects. Feeding hydrogen and nitrogen or oxygen to the plasma produces H and N or O atoms for rapidly removing organic contamination from semiconductor materials.
Here’s what our customers say:
Argon Plasma From Surfx Technologies
Surfx Technologies offers atmospheric, multigas plasmas for faster, safer and more versatile surface treatment. Our plasma:
Effectively removes microscale contamination without damaging surfaces
Using our equipment, engineers can assemble packages that are less likely to short, corrode, delaminate, or disbond during their lifetime.
Semiconductor Solutions
Particle-free silicon dioxide activation for hybrid bonding
Metal oxide removal for flux-free micro-bump bonding
Fluorine contamination removal after plasma dicing on tape
Surface activation for inkjet printing
Surface cleaning for glass wafer and panel reclaim
STW-10
300 mm wafers and dies on tape frames
STA-10
All Other Packages
INT
For integration into your equipment
Groundbreaking Plasma
Everything you once did in vacuum you can now do much faster, one part at a time, at ambient pressure.
Plasma cleaning removes microscale contamination from surfaces, activates surfaces for wetting and adhesion, eliminates voids and bubbles, and improves bonding, sealing and encapsulation. Surfaces treated with our atmospheric argon plasma technology create assembled products that are less likely to corrode, delaminate, or come unglued during their lifetime.
In semiconductor packaging, hydrogen plasma cleaning of micro-bump arrays removes oxidation from copper, tin-silver alloy, and indium, enabling flux-free flip chips.
It’s easy to integrate Atomflo™ plasma into your semiconductor process equipment, click here to find out more.
Turnkey Processing Equipment
Surfx Technologies offers fully automated plasma systems for surface cleaning and activation in high-volume production. Our STA-10iL will process a variety of substrates, including trays, lead frames, panels and boards. Our STW-10 will process 300mm wafers delivered in FOUPs, or 300mm die on tape frame delivered in cassettes.
Our Atomflo™-INT plasma engine is ideal for integrating plasma into other semiconductor process equipment. This system allows for outstanding data logging and process control. It is designed to meet all SEMI and EU standards for environmental health and safety. Contact our sales engineers to learn more.
No more worries about cross contamination or damage to semiconductor dies and packages.
Surfx’s multigas plasmas will not damage electrically sensitive integrated circuits. The highly uniform beam of reactive gas flowing out of the plasma head is 100% electrically neutral, containing only H, N, or O radicals with no streamers, no sparks, no electrostatic discharge (ESD), and no particles, and it emits very little UV light.
Printed Circuit
Board Assembly
High-volume surface preparation for:
Conformal coating
Potting and bonding
Combine atmospheric plasma with dispensing or coating tools for “just-in-time” cleaning.
Schedule a Free On-Site Demo Today
If you want to see how our plasma machines work, schedule a free demonstration by filling out the online form. One of our sales engineers will contact you to discuss your application. Alternatively, contact our team online to find out more about our products.