Semiconductor Packaging
Plasma Applications for Semiconductor Packaging
Semiconductor packaging plasma processing improves reliability and yield — even when the use of advanced materials increases and package sizes decrease. Chip manufacturers can rely on plasma processes to enhance various semiconductor applications.
Cleaning Processes
Surface cleaning is one of the primary applications of plasma treatment. Our plasma cleaning process in semiconductor manufacturing can remove organic and inorganic contaminants while safeguarding surface topography. Clean surfaces can increase device yield and cut the cost of post-cleaning inspections. Our plasma effectively removes contaminants without damaging sensitive components like bare wafers. Our plasma cleans substrates through surface chemistry reactions.
Flip Chip Cleaning
Precision plasma control in advanced microelectronics allows for benefits such as:
- Remove oxides from tin, copper and indium micro-bump arrays without using flux chemicals.
- Plasma treatment is a greener process that reduces chemical waste and water consumption.
- Our plasma process relies on atmospheric pressure hydrogen and argon plasma to remove oxidation.
Wire Bonding Preparation
Removing thin oxide layers and organic contaminants from bond pads before wire bonding can lessen bond failures and enhance yield. Lead frame plasma processing prior to wire bonding can also increase bond pull strength.
Activating Processes
Surface activation is also a popular plasma application. Chip makers use plasma to boost the material’s surface energy to enhance adhesion. Better bonding is especially helpful during the painting, bonding and coating processes. Enhanced adhesion improves the durability and quality of the end product.
Underfill Preparation
Hybrid Wafer Bonding Preparation
Molding Preparation
Rely on Surfx Technologies for Advanced Plasma Processing
Surfx Technologies offers automated plasma systems for high-volume semiconductor manufacturing. Our systems enhance process control. Where vacuum plasma processes parts in batches, our systems allow for processing parts in a continuous line. Our plasma also cleans surfaces without damaging them.
We offer the STA-10iL automated system, which is ideal for semiconductor packaging. As a premier semiconductor plasma cleaning system, our STA-10iL also activates substrates for enhanced adhesion and is suitable for high-volume applications. We also offer the STW-10 automated system for front-end semiconductor processing. It works well for activating surfaces before hybrid wafer bonding.
Book a Free On-Site Demo
Experience our technology in action. As a semiconductor plasma equipment manufacturer, Surfx plasma offers a superior bond. Request a demo today by filling out our form, and one of our sales engineers will reach out to you to discuss your unique needs and recommend the best system for your application. Alternatively, you can contact our sales engineers online for more information on our products.