STA-10iL: Automated Plasma System for In-Line Substrate Cleaning

Addressing Surface Prep Challenges in Electronics and Packaging

Precision manufacturing requires clean surfaces. Any contamination can impact the final product. Legacy systems often fail to achieve the results needed from high-performance applications, leading to unclean or damaged substrates. It’s common to see:

• Organic contamination: Residual organics can interfere with coating, bonding, or encapsulation.
• Surface oxidation on metals: This contamination can reduce bond strength and cause reliability failures.
• Inefficient tools: When tools fail to scale with production or damage sensitive parts, facilities lose money and face bottlenecks.

The STA-10iL addresses these problems with advanced atmospheric plasma cleaning that suits both high-volume and high-mix production environments.

Designed for Flexibility and Throughput

The STA-10iL combines high-speed motion control with a scalable, modular design to support diverse manufacturing needs. The standard system includes in-line conveyance for continuous, unattended processing in large-scale production. It also features an optional drawer configuration that makes setup and part access convenient for lower-volume operations.

A three-axis gantry system directs plasma only where needed, minimizing waste. The Atomflo™ plasma system controller produces a uniform, electrically neutral discharge that is particle-free and safe on sensitive microelectronics. It operates at a low voltage and uses a combination of process gases to remove organic residues and metal oxides.

Key Benefits of the STA-10iL System

Choose the STA-10iL for consistently clean surfaces and improved substrate activation for packaging, coating, and bonding operations. Surfx Technologies’ system offers the electronics manufacturing and semiconductor packaging industries these benefits:

• Flexible integration: Choose from in-line conveyance for high-volume production or drawer access for high-mix production. The STA-10iL is SMEMA-compatible and supports factory communication protocols.
• Traceable, compliant design: Built for clean room Class 100 environments, with inert gas purge, substrate cooling and heating, and full process traceability.
• Safe plasma cleaning: The system supports hydrogen plasma for metal oxide removal and oxygen plasma for organic cleaning, without damaging sensitive assemblies.

A Versatile Tool for High-Volume Manufacturing Equipment Lines

Whether supporting wafer-level packaging, component assembly, or final module preparation, the STA-10iL fits seamlessly into high-volume manufacturing equipment lines. Its configurable head, precise motion system, and cloud-based operating system ensure easy control and traceability.

For teams searching for substrate cleaning equipment that protects product integrity and scales with demand, the STA-10iL is standing by. It’s a solution that keeps pace with strict industry regulations and fast-paced outputs.

Invest in Clean, Traceable Surface Prep

Experience a powerful combination of speed, precision, and process safety with the STA-10iL. Surfx Technologies is dedicated to delivering proven results in semiconductor plasma cleaning. We design systems to maximize uptime, control, and safety. Our patented atmospheric plasma process removes surface contaminants while preserving substrate integrity.

We support every STA-10iL system with direct engineering guidance, technical support, and long-term service contracts. Our customers can scale confidently and reduce production risks. Contact us online to learn how our solutions can fit your production needs.