Products
Surfx Technologies provides advanced argon plasma surface treatment solutions tailored for the semiconductor and advanced packaging industries. Our atmospheric plasma systems enable precise surface activation, cleaning, and preparation—supporting high-reliability bonding, fine-pitch interconnects, and next-generation device assembly.
Whether for wafer-level packaging, die attach, or hybrid bonding, Surfx delivers particle-free, low-temperature plasma systems designed for high-performance electronics manufacturing.
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Atomflo™-INT
for integration of plasma treatment into other manufacturing tools
The Atomflo™-INT plasma system is configured for integration into new or existing process equipment. External rack-mounted controllers support 1 or 2 plasma heads imbedded inside the primary machine. Communication over Ethernet IP provides complete process control and data logging. The INT complies with all US, EU, and SEMI EH&S standards. Our integrated plasma systems provides the most advanced surface treatment technology inside your equipment.
STW-10
for plasma processing 300 mm wafers and dies on tape frames
The STW-10 automated plasma system is designed for front-end semiconductor processing. It is well suited for activating silicon surfaces prior to hybrid bonding. The STW-10 accepts FOUP’s containing 300 mm wafers, or cassettes with dies on tape frames. Maximum throughput is 60 wafers per hour.
STA-10
for high-volume manufacturing of semiconductor packages
The STA-10iL automated plasma system is designed to clean and activate substrates for improved bonding. It is the ideal plasma system for electronics manufacturing and semiconductor packaging. The STA-10iL comes standard with in-line conveyance for high-speed, high-volume production. An optional drawer can be installed for high-mix, low-volume production.
Atomflo™ 600 plasma controller and coolant control module
The Atomflo™ 600 controller is the brains of our advanced argon plasma technology. It is equipped with a radio frequency power supply, auto-tuning matching network, three mass flow controllers for argon, nitrogen or oxygen, and hydrogen (5%H2/Ar), a computer with Windows 10 operating system, and an eight-inch touch screen.
Atmospheric plasma sources
SPS-100
The SPS-100 is a linear beam plasma source, 100 mm wide, designed to clean and activate substrates for improved bonding and adhesion. It is supplied with RF power, gas feed, optical detection, and water cooling from the Atomflo™ 600 controller and CCM. This head is particularly well suited for semiconductor processing.
SPS-M
The SPS-M is a spot plasma source designed to clean and activate substrates for improved bonding and adhesion. It treats a circular area about one centimeter in diameter. It is ideal for selective processing of semiconductor packages and printed circuit boards.
SPS-50
The SPS-50 is a 50 mm linear beam plasma source designed for precise surface cleaning and activation. Powered by the Atomflo™ 600 controller, it’s ideal for sensitive substrates and advanced manufacturing. Key applications include semiconductor wafer preparation and electronics assembly.
SPS-25
The SPS-25 is a 25 mm linear beam plasma source designed for precise surface cleaning and activation. Powered by the Atomflo™ 600 controller, it safely treats sensitive substrates using argon and process gases. It’s ideal for applications in electronics, medical devices, and semiconductor manufacturing.