Surfx Technologies is proud to have had a strong presence at SEMICON Taiwan 2025, led by our Surfx Taiwan team. The event provided an excellent opportunity to highlight how atmospheric argon plasma enables cleaner, more reliable, and production-ready surface preparation for advanced semiconductor packaging.
Our Taiwan team connected with industry leaders, partners, and innovators throughout the show, sharing how Surfx plasma technology can enhance adhesion, improve device reliability, and streamline process integration. Their efforts on the ground made this participation a success and strengthened our commitment to supporting the local and global semiconductor ecosystem.
We sincerely thank everyone who visited our booth and engaged with us during the event. Surfx remains dedicated to enabling next-generation semiconductor manufacturing through safe, precise, and scalable plasma solutions.
