Applications
Surfx’s atmospheric argon plasmas have applications in many industries.
Below you’ll find examples that we have provided solutions for. Contact us to learn more.
Semiconductor Packaging
Flux-free flip chip
Remove oxidation from indium, tin, and copper micro-bump arrays using the atmospheric pressure hydrogen and argon plasma
Hybrid wafer bonding
Activate glass films for direct fusion bonding without adding any particles to the wafer surface
Underfill
Activate surfaces underneath BGAs, CSPs or flip chips prior to dispensing underfill
Wire bond
Remove organic contamination from bond pads on lead frames prior to wire bonding
Molding
Activate lead frames and other packages for adhesion prior to encapsulating dies in an epoxy mold
Electronics Assembly
Wetting and adhesion
Improve adhesion of ink, glue, and coatings
Conformal coating
Eliminate voids, improve coverage over entire printed circuit board, and enhance coating adhesion
Aerospace and Automotive
Bonding composite structures
Prepare the surface of composite structures for adhesive bonding in aircraft and satellite assembly
Bonding fasteners
Clean and activate fasteners to ensure strong adhesion for the life of the aircraft
Bonding transparencies
Activate the surface for coating or bonding without affecting the optical properties of the polymeric material
Potting sensors
Activate 3-D sensor housings to improve wetting, adhesion, and sensor durability throughout operating lifetime
Camera assembly
Clean optics and housing before adhesive bonding
Medical Devices and Diagnostics
Wetting
Improve wetting to polymers and other materials for precision dispensing of biological media onto surfaces
Stent and catheter activation
Activate low-energy thermoplastic tubing for bonding, coating, or printing