Surfx Technologies is excited to announce its participation in the IMAPS Device Packaging Conference (DPC) from March 4-6, 2025 in Phoenix, Arizona. We will be showcasing our cutting-edge Atomflo™ plasma technology at Booth 508.
What You Can Expect to See At Our Booth
At our booth, we will be featuring our Atomflo™ technology and our Atomflo™-INT. The Atomflo™-INT (Integration) version is specifically designed for easy integration and communication to any host machine such as a die bonder or EFEM. This means that everything you once did in vacuum you can now do much faster at ambient pressure.
Check Out Our Poster Presentation at DPC 2025
On Wednesday, March 5, we will be sharing our poster presentation. Discover an excerpt of our insights below!
In Situ Hydrogen Plasma – A New Paradigm for Advanced Packaging
Robert Hicks
Surfx Technologies, Redondo Beach, CA, USA
Abstract
Atmospheric argon plasma advancements offer new ways to prepare die and wafers for a multitude of bonding applications. This new and enabling technology is worth studying as two- and three-dimensional stacking of integrated circuits is at the forefront of semiconductor advanced packaging. These advanced packages are required across the spectrum of semiconductor devices, including memory, microprocessors and communication devices. Tremendous demand for these devices is being driven by applications in artificial intelligence, data storage in the cloud, high-performance computing, autonomous vehicles on land and in the air, and 5G communications.
Critical to stacking chips is the bonding together of a two-dimensional array of interconnects in a flip chip design. The pitch between interconnects should be 50 microns or less in order to achieve required I/O densities, and at the same time, provide communication speeds in the gigahertz range without significant signal loss.
An atmospheric pressure plasma suitable for use in advanced packaging must meet several requirements. It must be low temperature eliminating the potential for thermal damage of the integrated circuits. It must not produce particles which can settle on the interconnect surfaces and block the formation of a solid metal-metal joint. It must generate a beam of hydrogen radicals that uniformly removes the metal oxide from the solder micro-bumps both on die and wafer surfaces. And lastly, it must not generate any electrostatic discharge that could damage the integrated circuits.
Learn more about how atmospheric argon plasma is enabling heterogeneous packaging in this paper about in-situ hydrogen plasma.
Event Details
- Conference Name: IMAPS Device Packaging Conference
- Dates: March 4-6, 2025
- Location: Phoenix, AZ
- Surfx Booth: 508
We look forward to connecting with industry professionals and sharing how our plasma technologies continue to revolutionize advanced packaging processes. Be sure to stop by Booth 508 to see the Atomflo™-INT in action and attend our poster session to get a deeper understanding of the possibilities of atmospheric argon plasma!