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Join Surfx Technologies at ECTC IEEE 75th Anniversary this May 2025!

by | Jan 7, 2025

Surfx Technologies is excited to announce its participation in the Electronic Components and Technology Conference from May 27 – 30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas,TX. Learn more about our Atomflo™ plasma technology features at Booth 339!

Explore Our Integration Capabilities

Visit our booth to explore our groundbreaking Atomflo™ technology, including the Atomflo™-INT. The Atomflo™-INT (Integration) model is expertly engineered for seamless integration and communication with host machines like die bonders and hybrid bonding equipment. Experience the transformation of processes traditionally done in a vacuum—now performed faster and more efficiently at ambient pressure!

Why Integrate Atomflo™ INT in Your Equipment?

The Atomflo™ is the perfect product for manufacturers of advanced semiconductor packages. As a result, makers of heterogeneously integrated system on chip (SoC) will benefit from the use of our atmospheric argon plasma technology. Download the Atomflo™ data sheet to discover how we can integrate with your existing bonding & placement equipment.

Download Atomflo™-INT Datasheet

Event Details

Don’t miss the chance to visit us at Booth 339 to witness the Atomflo™-INT in action! Register for the upcoming conference by visiting their site!

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