Culver City, CA, March 15, 2005— Joel Penelon, Director of Marketing, commented, “The customer is pleased with our product’s ability to tackle several tough problems in microelectronics packaging. Our atmospheric RF plasmas are quickly gaining acceptance in this market space, and we are well positioned to take advantage of the business opportunity.  I am also excited about the new products in our pipeline.  This summer we will introduce a powerful new atmospheric plasma tool for the rapid, in-line processing of 3D components.”

Surfx offers the most advanced atmospheric plasmas on the market. Customer are recognizing that our products provide the versatility, ruggedness and reliability that they need for their most demanding applications.