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Click here to request a free copy of our Application Notes. These notes describe the principles of operation of different atmospheric plasmas, including coronas, dielectric barrier discharges, plasma torches, and the Atomflo™ RF plasma. In addition, they describe the use of atmospheric plasma for surface treatment, including plasma cleaning, plasma coating, etching, and surface activation for adhesion.

To see the Atomflo™ atmospheric plasma system in action, visit our multimedia page.

Introduction

Our atmospheric plasma is a low temperature source of atoms and radicals. These reactive species are delivered to the sample to clean, remove, modify, or deposit a material of your choice. The Atomflo™ is the only atmospheric plasma on the market that offers a broad range of surface chemistries.  An inert gas, helium or argon, is fed to the source along with a few percent of gas molecules, such as oxygen, hydrogen, nitrogen, or carbon tetrafluoride, thereby generating O, H, N or F atoms to plasma treat the surface.

The Atomflo™ provides all the power of plasma chemistry with none of the hassle of vacuum operation. Moreover, there is no risk of electrical shock from the source.  In the sections below, we describe some of the valuable uses of our exciting product.


Surface Treatment

The chemical species generated by the plasma quickly modify the surface of polymers, composites and other materials. Oxygen plasmas are especially effective for improving adhesion. This effect is evident upon checking the wettability after a short exposure to the Atomflo™ atmospheric plasma. Beforehand, water droplets bead up on the plastic surface, whereas after exposure, the droplets spread out flat. We have measured the surface energy of many plastics after plasma treating them, including polyethylene (LDPE and HDPE), polystyrene, polycarbonate, polypropylene, polyetheretherketone, nylon and silicone rubber.  After a 1/4 second treatment, the average surface energy increased by more than 25 dynes/cm. If you have a bonding problem, the Atomflo™ is very likely the most cost effective solution you can find.



Atomflo™-500R scanning over plastic parts for surface treatment (Patents Pending)

 

 

Video of Surfx® Plasma Treatment on Silicon Wafer (3 MB, WMV format):


Plasma Coating

Plasma-enhanced chemical vapor deposition (PECVD) is widely used to coat thin films onto other materials. These films serve many purposes. Silicon dioxide and silicon nitride layers are essential components of integrated circuits. Diamond-like coatings increase the wear and corrosion resistance of metal parts. Nanocoatings of glass on plastic sheet prevent oxygen and moisture penetration, and improve packaging. Thicker glass coatings may be used for scratch protection on structural plastics.

Our plasma sources are configured for PECVD by integrating a proprietary precursor distributor into the applicator. In addition, a delivery system is provided for the controlled introduction of the precursor to the gas stream. Many different chemicals are available, depending on the material you wish to deposit. For example, hexamethyldisilazane may be combined with an oxygen plasma to generate glass coatings, or with a nitrogen plasma to produce silicon nitride. The beauty of our product is that you can coat 3D objects of any size or shape.

Plasma coating is a domain of excellence for Surfx Technologies. We have developed many novel processes and will support new applications as needed for our customers.


Plasma Cleaning

The Atomflo™ oxygen plasma produces a stream of O atoms that quickly strips organic films from surfaces. The reaction byproducts are carbon dioxide and water. The organic films can be etched away at rates approaching several microns per second, and with exceptional uniformity across the surface!

Atmospheric plasma cleaning may be combined with water rinsing to achieve critical cleans that do not generate hazardous waste disposal problems.

Viruses and bacteria are organic materials, and are quickly destroyed on contact with an oxygen plasma. Thus, our products may be used for sterilization and decontamination.


Removal of buffer from fiber optics


Plasma Etching

To etch metals, glass and semiconductor films, one can feed 3% carbon tetrafluoride and 1% oxygen in argon to the Atomflo™ atmospheric plasma tool. This mixture will produce a high density of fluorine atoms that will etch tungsten, tantalum, silicon and many other thin films at several microns per minute between 200 and 300 °C. See the News and Literature section for publications on this topic.



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