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Click
here to request a free copy of our Application Notes. These
notes describe the principles of operation of different atmospheric plasmas, including coronas,
dielectric barrier discharges, plasma torches, and the Atomflo™ RF plasma. In addition, they describe the use of atmospheric plasma for surface treatment, including plasma
cleaning, plasma coating, etching, and surface activation for adhesion.
To see the Atomflo™ atmospheric plasma system in action, visit our
multimedia page.
Introduction
Our atmospheric plasma is a low temperature source of
atoms and radicals. These reactive species are delivered to the sample to clean, remove, modify,
or deposit a material of your choice. The Atomflo™ is the only
atmospheric plasma on the market that offers a broad range of surface
chemistries. An inert gas, helium or argon, is fed to the source
along with a few percent of gas molecules, such as oxygen, hydrogen,
nitrogen, or carbon tetrafluoride, thereby generating O, H, N or F atoms
to plasma treat the surface.
The Atomflo™ provides all the power of plasma chemistry with none of the hassle of vacuum
operation. Moreover, there is no risk of electrical shock from
the source. In the sections below, we describe some of the
valuable uses of our exciting product.
Surface Treatment
The chemical species generated by the plasma quickly modify the surface of
polymers, composites and other materials. Oxygen plasmas are especially effective for improving adhesion. This effect is evident upon checking the wettability after a short
exposure to the Atomflo™ atmospheric plasma. Beforehand, water droplets bead up on the plastic
surface, whereas after exposure, the droplets spread out flat. We have
measured the surface energy of many plastics after plasma treating them,
including polyethylene (LDPE and HDPE), polystyrene, polycarbonate,
polypropylene, polyetheretherketone, nylon and silicone rubber.
After a 1/4 second treatment, the average surface energy increased by
more than 25 dynes/cm. If you have a bonding problem, the
Atomflo™ is very likely the most cost effective solution you can find.
 Atomflo™-500R
scanning over plastic parts for surface treatment (Patents Pending)

Video of
Surfx® Plasma Treatment on Silicon Wafer (3 MB, WMV format):
Plasma Coating
Plasma-enhanced chemical vapor deposition (PECVD) is widely used to coat thin films onto other
materials. These films serve many purposes. Silicon dioxide and silicon nitride layers are essential components of integrated circuits.
Diamond-like coatings increase the wear and corrosion resistance of metal parts. Nanocoatings of glass on plastic sheet prevent oxygen and
moisture penetration, and improve packaging. Thicker glass coatings may be used for scratch protection on structural plastics.
Our plasma sources are configured for PECVD by integrating a proprietary
precursor distributor into the applicator. In addition, a delivery system is provided for the controlled introduction of the precursor
to the gas stream. Many different chemicals are available, depending on the material you wish to deposit. For example,
hexamethyldisilazane
may be combined with an oxygen plasma to generate glass coatings, or
with a nitrogen plasma to produce silicon nitride. The beauty of our
product is that you can coat 3D objects of any size or shape. Plasma coating is a domain of excellence for Surfx Technologies. We have developed many novel
processes and will support new applications as needed for our customers.
Plasma Cleaning
The Atomflo™ oxygen plasma produces a stream of O
atoms that quickly strips organic films from surfaces. The reaction
byproducts are carbon dioxide and water. The organic films can be etched
away at rates approaching several microns per second, and with exceptional uniformity across the
surface!
Atmospheric plasma cleaning may be combined with
water rinsing to
achieve critical cleans that do not generate hazardous waste disposal problems.
Viruses and bacteria are organic materials, and are quickly destroyed on contact with an
oxygen plasma. Thus, our products may be used for sterilization and decontamination.
Removal of buffer from fiber optics Plasma Etching
To etch metals, glass and
semiconductor films, one can feed 3% carbon tetrafluoride and 1% oxygen
in argon to the Atomflo™ atmospheric plasma tool. This mixture will
produce a high density of fluorine atoms that will etch tungsten,
tantalum, silicon and many other thin films at several microns per
minute between 200 and 300 °C. See the News and Literature section for publications on this topic.
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